Dell PowerEdge R650xs 1U Rack Server | Refurbished
PowerEdge R650xs
Dell
Dell PowerEdge R650xs – 1U Dual-Socket Rack Server
A compact 1U chassis built for scale-out density, the R650xs pairs two sockets with the efficiency Dell needed to hit an aggressive price-performance target for medium-duty workloads.
It runs 3rd Generation Intel Xeon Scalable processors, up to 32 cores per socket, backed by 16 DDR4 DIMM slots running at 3200 MT/s for a 1TB memory ceiling.
Storage is genuinely flexible: choose 3.5-inch bays for bulk capacity or 2.5-inch NVMe-capable configurations for latency-sensitive workloads, and pair either with PERC or HBA controllers depending on the RAID or pass-through requirement. Three PCIe Gen4 slots plus an OCP 3.0 mezzanine keep networking and accelerator options open.
iDRAC9 and the OpenManage stack handle lifecycle management, telemetry and firmware security, including Silicon Root of Trust.
Every unit sold through our configurator is built to your specification – processor count, memory capacity, drive type and quantity, and RAID controller are all selectable before checkout.
All hard drives are tested to 100% health · All SSDs are tested to 90-100% health
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Contact Us About StockAbout the Dell PowerEdge R650xs
The PowerEdge R650xs packs dual 3rd Generation Xeon Scalable processors, up to 1TB of DDR4 memory and flexible NVMe-ready storage into a single rack unit, making it a natural fit for scale-out clusters where density and cost per node matter.
Configure the processor pair, memory footprint, drive bays and RAID controller to match the workload in front of you, whether that's a virtualisation host, a scale-out database node or a general-purpose compute tier.
Configure to order
Use the options below to build a specification suited to your environment. Every configuration is assembled to order and backed by our 3 year warranty.
Typical Use Cases
- Virtualisation hosts running VMware ESXi, Hyper-V or Proxmox
- Scale-out database nodes across sharded or distributed architectures
- High-Performance Compute cluster nodes where density per rack unit matters
- Medium-density VDI delivery for departmental or branch deployments
- Software-defined storage nodes using HBA pass-through and NVMe drives
- Web and application tier scaling in colocation or private cloud environments
- CI/CD build farms needing consistent, replaceable compute units
- General-purpose enterprise workloads replacing older 1U dual-socket servers
Key Specifications
| Processor | |
|---|---|
| Processor Family | 3rd Generation Intel Xeon Scalable |
| No of Processors | Up to two |
| Cores Per Processor | Up to 32 cores |
| Memory | |
| Memory Type | DDR4 RDIMM |
| RAM Type | Registered ECC DDR4 DIMMs |
| Memory Speed | 3200 MT/s |
| Memory Slots | 16 DDR4 DIMM slots |
| Maximum Capacity | 1 TB |
| Storage Controllers | |
| Internal controllers | PERC H345, PERC H355, PERC H745, PERC H755, PERC H755N, HBA355i, S150 |
| Boot Storage Option | Internal Dual SD Module, Boot Optimized Storage Subsystem (BOSSS1): HWRAID 2 x M.2 SSDs, USB |
| External Controller | PERC H840, HBA355e |
| Storage | |
| Drive Bays 3.5 inch | Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) |
| Drive Bays 3.5 inch Max Capacity | 64 TB |
| Drive Bays 2.5 inch | Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) |
| NVMe PCIe | Up to 10 NVMe drives |
| Rear Drive Bays | Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 15.36 TB |
| Power | |
| Power Supply Options | 600W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant, 700W Titanium Mixed Mode (200-240Vac or 240Vdc) hot swap redundant, 800W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant, 1100W Titanium Mixed Mode (100-240Vac or 240Vdc) hot swap redundant, 1400W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant, 1100W -48Vdc hot swap redundant, 1800W Titanium Mixed Mode (200-240Vac or 240Vdc) hot swap redundant |
| Chassis | |
| Form Factor | 1U rack server |
| Chassis Width | 482 mm (18.97 inches) |
| Chassis Depth (3.5 inch HDD) | 734.95 mm (28.92 inches) without bezel, 748.79 mm (29.47 inches) with bezel |
| Expansion Slots | |
| PCIe Configuration | Up to 3 x PCIe Gen4 slots |
| Networking | |
| Network Interface | 2 x 1 GbE LOM, 1 x OCP 3.0 |
| I/O Ports | |
| Front USB Ports | 1 x USB 2.0, 1 x iDRAC Direct (Micro-AB USB) port |
| Rear Ports | 1 x USB 2.0, 1 x Serial (optional), 1 x USB 3.0, 2 x Ethernet, 1 x VGA |
| Management | |
| Embedded Management | iDRAC9, iDRAC Service Module, iDRAC Direct, Quick Sync 2 wireless module |
| Security | |
| TPM | TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ |
| Security Features | Cryptographically signed firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter) |